Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester

Name: Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester
Brand: DONGGUAN LONROY EQUIPMENT CO LTD
Price: 1 USD
Availability: InStock

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Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester

Large Image : Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester

Product Details:

Place of Origin:	Guangdong, China
Brand Name:	LONROY

Payment & Shipping Terms:

Minimum Order Quantity:	1
Price:	$1,000

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Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester

Description

Machine Type:	Magnetron Sputtering Coater	Voltage:	380VAC±10%
Power(w):	5000	Warranty:	1 Year
Weight (kg):	600
Highlight:	Four-Target Magnetron Sputtering Coater with Load-Lock Chamber , PVD Thin Film Coating Instrument for Alloy Membranes , Lab Test Machine Sputter Tester

Products Description

Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester

Brief Introduction The four-target magnetron sputtering coating system is designed for the deposition of various thin films, including ferroelectric, conductive, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, and PTFE films.

Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester

Detailed Introduction This four-target magnetron sputtering coating system is a cost-effective unit independently developed by our company, featuring a standardized, modular, and customizable design. Customers can select magnetron targets in sizes ranging from 1 to 4 inches based on their substrate dimensions. The system is equipped with 500W DC and 500W RF power supplies; the DC supply is suitable for metal films, while the RF supply handles non-metallic films. The four-target configuration supports multi-layer or sequential coating processes. Custom RF and pulsed power supplies are available upon request, with various specifications ranging from 300W to 1000W. The equipment consists of a main chamber and a load-lock chamber (transition chamber). The load-lock chamber features a magnetic transfer rod, and a vacuum gate valve separates the two chambers. This design allows users to load samples and perform pre-vacuuming in the load-lock chamber while sputtering takes place in the main chamber. Once the main process is complete, the sample can be transferred onto the main chamber's stage using the magnetic rod. This setup minimizes the frequency of main-chamber vacuum cycling, thereby saving time, maintaining a superior vacuum environment, and effectively enhancing coating quality. The four-target magnetron sputtering coating system is suitable for depositing single or multi-layer films such as ferroelectric, conductive, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, and PTFE films. Compared to similar equipment, this four-target magnetron sputtering system offers not only broad applicability but also the advantages of a compact size and ease of operation, making it an ideal tool for laboratory thin-film fabrication. The entire deposition process takes place in a high-vacuum environment, ensuring that evaporated atoms or molecules reach the substrate directly; this prevents contamination by atmospheric impurities and enhances film quality. High-vacuum conditions also help minimize the oxidation of the source material, further improving the purity and performance of the resulting thin film.

Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester

Specification

Technical Specifications

Category	Item	Specification
Product Name	Four-Target Magnetron Sputtering Coater (DC Power + RF Power)
Product Model	LR-CK101
Sample Stage	Dimensions	φ150 mm
		Temperature Control Accuracy	±1°C
		Heating Range	Room temperature to 900°C
		Adjustable Rotation Speed	1–20 rpm (adjustable)
Magnetron Target Guns	Sputtering Direction	Downward sputtering
		Tilting Target Angle Range	-45° to +45°; equipped with pneumatic shutter
		Target Material Dimensions	4-inch diameter, thickness ≤3 mm
		Insulation Voltage	>2000 V
		Quantity	Three 4-inch tilting targets; one 4-inch fixed target
		Cooling Method	Water cooling
Vacuum Chamber	Chamber Type	D-type chamber
		Chamber Dimensions	Φ500 mm × 500 mm
		Chamber Material	304 Stainless steel
		Observation Window	Quartz window, φ100 mm diameter
		Opening Method	Front-opening door
Gas Control	Flow Control	3-channel mass flow controllers:Range: 0–500 SCCM;Range: 0–100 SCCM;Range: 0–20 SCCM
Bipolar Pulsed Magnetron Sputtering Power Supply	Input Voltage	380 VAC ±10%, 3-phase 4-wire system, 50–60 Hz
		Output Power	0–5 kW
		Output Voltage	0–1000 V
		Output Current	Max. 9 A (at constant power)
		Output Frequency	1 kHz – 150 kHz
		Output Characteristics	Constant current / Constant power / Constant voltage
		Cooling Method	Air cooling
		Communication	0–5 V or 0–10 V analog signal; RS-485
		Duty Cycle	100%
		Quantity	1 unit
RF Power Supply Source	Power supply rating	1000W
		Power output range	0W–1000W
		Maximum output power	1000W
		Maximum reflected power	130W
		RF frequency	13.56 MHz (stability: ±0.005%)
		Quantity	1 unit
DC Power Supply	Power	1000W
DC Power Supply		Quantity	2 units
Molecular Pump	Pumping speed	1200 L/s
		Cooling method	Water-cooled
		Vacuum level	9.0 × 10⁻⁴ Pa
		Fore-pump pumping speed	4 L/s
		Compound Vacuum Gauge	Measurement range 10⁻⁵ Pa – 10⁵ Pa
		Quantity	1 set
		Vacuum Valve	Electrically controlled pneumatic valve
Transition Chamber	Chamber size Suitable for wafers up to 6 inches
Transition Chamber		Equipped with molecular pump assembly:Fore-pump: VRD-4 (pumping speed: 1.1 L/s)Molecular pump: TG60F (Japan) (pumping speed: 60 L/s)
Film Thickness Monitor	Quantity	1 set
		Channels	Single channel
		Measurement precision	1 Å
		Standard sensor quartz crystal	6 MHz
		Compatible quartz crystal size	φ14 mm
Water Chiller	Temperature control range	10–25°C
		Rated cooling capacity	0.75 kW
		Flow rate	10 L/min
		Cooling water	Purified water
Air Compressor	Rotation speed	1380 rpm
		Flow rate	40 L/min
		Rated discharge pressure	0.7 MPa
Control System	PLC + 14.3-inch touchscreen

Our Advantages

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Contact Person: Kaitlyn Wang

Tel: 19376687282

Fax: 86-769-83078748

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Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester

Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester

Four-Target Magnetron Sputtering Coater with Load-Lock Chamber PVD Thin Film Coating Instrument Alloy Membranes Sputter Tester

Four-Target Magnetron Sputtering Coater with Load-Lock Chamber

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