Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System

Name: Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System
Brand: DONGGUAN LONROY EQUIPMENT CO LTD
Price: Negotiable USD
Availability: InStock

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Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System

Large Image : Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System

Product Details:

Place of Origin:	Guangdong, China
Brand Name:	LONROY

Payment & Shipping Terms:

Minimum Order Quantity:	1

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Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System

Description

Type:	Testing Machine	Accuracy Class:	High Accuracy
Accuracy:	±1.5%	Application:	Auto Testing, Laboratory Testing, Lab Testing
Customized Support:	OEM, OBM, ODM, Software Reengineering	Power:	/
Protection Class:	IP57	Voltage:	220 V, Other
Warranty:	1 Year
Highlight:	Programmable Dip Coater , Multi-layer Dip Coating System , Sol-gel Dip Coating Machine

PRODUCT HIGHLIGHTS

Utilizes a servo motor drive combined with a high-quality imported vertical lifting mechanism and a programmable control system to ensure operational precision and stability. The servo motor offers superior precision, smoothness, and vibration-free operation compared to stepper motors. The imported vertical lifting mechanism features high precision, zero-backlash transmission, smooth operation, corrosion resistance, maintenance-free performance, and a long service life.
Fully automatic program control with multiple adjustable parameters. There are six adjustable parameters: descent speed, immersion time, withdrawal speed, coating dimensions, number of coating cycles, and interval time between cycles; all parameters are continuously adjustable for precise control. Once the coating program is set, the entire process—from descent and immersion to withdrawal and coating—runs automatically.
Operation is smooth at both high and low speeds; the liquid surface remains undisturbed during the coating process, resulting in a uniform coating free of streaks.
A 4.3-inch LCD touchscreen facilitates easy control. Parameters are displayed in real-time during operation, providing a clear, intuitive view of the coating process.
Limit sensors are installed at both the top and bottom ends; the system automatically stops upon reaching these limits, preventing over-travel during ascent or descent.
A uniquely designed flat-jaw clamp grips the sample evenly from both sides without causing damage.

Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System

Product Application The dip-coating machine is primarily used to prepare thin-film materials via liquid-phase methods, such as the sol-gel process. A clean, dry substrate is immersed in a solution (sol) and then vertically withdrawn at a preset speed. This process deposits a layer known as a "wet gel film" onto the substrate; as the solvent evaporates from this layer, it solidifies into a "dry gel film." Subsequent drying and high-temperature heat treatment transform the dry gel film into the desired nanomaterial thin film. Film thickness is determined by the withdrawal speed, liquid concentration, and liquid viscosity. Product Overview This dip-coating machine is specifically designed for research into thin-film preparation via liquid-phase methods (particularly the sol-gel process), enabling film growth on various substrates through dip-coating. Parameters such as withdrawal speed, withdrawal height, immersion time, number of coating cycles (for multi-layer deposition), and intervals between coatings are continuously adjustable and precisely controlled. There are no special requirements for the substrate; coating can be applied to sheet, block, or cylindrical shapes. The system operates stably with no vibration at the liquid surface, significantly enhancing experimental precision and efficiency. It is suitable for coating the surfaces of various solid materials, including silicon wafers, crystal wafers, glass, ceramics, and metals, and is applicable to both scientific research and industrial production.

Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System

Technical Specifications

Withdrawal Speed Range	1～6000 μm/s, minimum resolution 1 μm/s; Optional models with low speed of 0.1 μm/s and 0.01 μm/s available
Speed Accuracy	-0.02% ~ +0.02%
Maximum Travel	Approx. 170 mm (subject to actual product)
Applicable Substrate Size	MIN 10×10 mm, MAX 100×100 mm, MAX Thickness 10 mm
Immersion Time	1～3600 s, minimum resolution 1 s
Coating Cycles	1～100 cycles, minimum 1 cycle
Interval Time Between Each Coating	1～3600 s, minimum resolution 1 s
Power Supply	220V/50Hz

Tag:

Contact Person: Kaitlyn Wang

Tel: 19376687282

Fax: 86-769-83078748

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Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System

Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System

Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System

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